As one of the leading manufacturer of Ferrite Cores in Taiwan . We obtained ISO 9002 certification since 1995, ISO 9001 certification in 1998.
New catalog for all series of SMT products have been published in January 2018.
New Ni-Zn material： E9S, E4DS, E4S, E4K, E5S, E5K, with High "Bm" , high " Tc" and high " Resistivity" and better "Thermal Shock", could be very good alternative to some of Mn-Zn material. Normally it's necessary to have epoxy or parylene coating on Mn-Zn cores because their resistivity are lower.
New "Lead Free" material：
μi 15〜200： NE5K2, LF2D, LF3, LFQ6, LF6, LF12, LF20
μi 1000〜2000： E6D, E6L, E6G, E10H
New Mn-Zn materials :
| JF3 - | Low power loss material (Similar FERROXCUBE 3F3) |
|---|---|
| JF35 - | Low power loss material (Similar FERROXCUBE 3F35) |
| JP44 - | Low power loss material (Similar TDK PC44) |
| JP95 - | Low power loss material (Similar TDK PC95) |
We not only supply the standard parts, but also can supply customer-design products, which shares over 80% of our production.
Our superiority is to supply clients with a variety of "Small Size Cores" for SMT application.
1. Patent Cores (Patent for Metallization on the Shield Core)
a) MSDRI : China Patent No. ZL02230366.9 / Taiwan Patent No. 222266
b) MLIDR : China Patent No. ZL02230365.0 / Taiwan Patent No. 221523
c) MLDRI : China Patent No. ZL02230364.2
2. SMT Cores
| a) DR Cores | |
| To meet the demand for smaller, thinner and more advanced features, we developed a series of drums for SMD Power Inductors. The smallest OD starts from 2 mm to 18 mm and height starts from 0.6mm to 10mm. | |
| b) Metalizing Cores ( MH & MSRIH & MDR & MDRI & MSDRI & MLIDR & MLDRI ) | |
| For SMD Power Inductors on Smartphone, Tablet, Notebook and 3C application. | |
| c) DRI series Cores & SDRI series Cores & LDRI series Cores & SDRP series Cores | |
| For SMD Power Inductors on Smartphone, Tablet, Notebook and 3C application. | |
| d) ER series Cores & ERC Cores | |
| ER series cores are also available including ER9.5, ER11 & ER14.5. | |
3. PQ EQ and I Cores.
4. Planar Cores
EE or EI type Cores without winding.
We have installed a brand-new coating technology- Parylene Deposition Equipment. The purpose of parylene coating is to get better control in thickness of coating and get excellent performance in Hi-Pot test.
1. Batch Kiln
For 10,000
i Mn-Zn cores & Low power loss cores.
2. 2-Tunnel Kiln for Ni-Zn
To increase 30 tons of Ni-Zn cores capacity.
Please feel free to contact us for any inquiries, we'll do our best to satisfy Your needs.
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YENG TAT ELECTRONICS
CO., LTD. No.25, Gongxing St., Shu-Lin Dist., New Taipei City, Taiwan, R.O.C. TEL: 886-2-2689-1473(REP.) FAX: 886-2-2689-4843 E-mail: sales@yeng-tat.com |
